PrecisioNext Signs Top-Tier OSAT Partner, Igniting Packaging Revolution with Mass Transfer Technology

PrecisioNext has secured a strategic partnership with a leading OSAT provider for its XBonder Pro FOPLP needle based mass transfer equipment.

NEW YORK, NEW YORK, UNITED STATES, September 23, 2025 /EINPresswire.com/ -- After six months of rigorous testing, PrecisioNext has secured a strategic partnership with a leading OSAT provider for its XBonder Pro FOPLP needle based mass transfer equipment - marking the first large-scale adoption of mass transfer technology in IC packaging. This breakthrough promises to transform both wafer-level (WLP) and panel-level (PLP) packaging. PrecisioNext is also collaborating with a global top-5 OSAT and major power device manufacturer on wafer-level applications of XBonder Pro.

The Core Challenge: Precision and UPH
Die transfer is the critical bottleneck in advanced packaging. As advanced packaging of PLP/ WLP require subsequent processes like Redistribution Layer (RDL) after die attach, the demand for die attach placement accuracy is extremely high (±7μm to ±3μm), traditional die bonders face an impossible tradeoff:
High-precision models achieve just hundreds UPH.
Throughput boosts require multiple bond heads/nozzles, increasing: machine complexity, capital costs, and failure rates from nozzle variability.
As IC designs increasingly feature smaller and more numerous chips, traditional die bonder (pick-and-place ) simply can't scale.

How Mass Transfer Changes the Game
PrecisioNext's needle-based technology delivers:
1. 10x Efficiency Gain vs traditional die bonding
2. Multi-fold Cost Reduction in die attach
3. 30K UPH at high precision (±3μm capable)
4. Zero Nozzle Wear issues that plague multi-head systems

Technical Breakdown: Pick-and-Place vs Needle Based Mass Transfer

Traditional Process (Industry Standard):
1. Ejector pins lift die through blue tape
2. Nozzle picks die via vacuum
3. Vision alignment precedes placement
→ Each action consumes precious milliseconds

PrecisioNext's Innovation:
1. Wafer flips upside down
2. Needle array aligns with substrate
3. Direct needle press die transfer in bulk
→ Eliminates 60% of movements

Proven in MiniLED production (300K+ UPH), this architecture has been adapted for IC packaging via the XBonder Pro series. The needle-type mass transfer process offers high efficiency and significantly reduces electricity and compressed air consumption, make FOPLP economically viable at scale, reduce capex/opex for advanced packaging lines.

PrecisioNext's partnerships with tier-1 OSATs validate mass transfer as the future of high-volume, precision packaging - finally breaking the UPH and accuracy deadlock that has constrained the industry.

Jack Li
Dongguan Precision Intelligent Technology Co., LTD
+86-13825438413
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